滨州YCC1206

类别:

滨州反贴

产品描述

特性 Features
■ 适用于所有的SMT 组装和焊接工艺   Suitable for all SMT assembly and soldering processes
■ 发光角度大   Extremely wide viewing angle

■ 反贴封装    Reverse chip packaging
■ 防潮级别:3 级   Moisture levels: level 3

■ 符合 RoHS 规范   Meet RoHS Certification

应用Applications
■ 光学指示   Optical indicator
■ 开关和标志,显示器等   Switches and signs, displays

■ 适用于需求发光面反向的应用场合   For applications where the luminous surface is reversed

■ 其他应用   General use